▎ 摘　　要

NOVELTY - The present invention discloses a heat dissipation structure and an electronic device. The heat dissipation structure includes a metal layer, a heat dissipation protection layer and a first adhesive layer. The heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes an overlapping structure of a polymer material layer and a heat dissipation coating. The first adhesive layer is disposed between the metal layer and the heat dissipation protection layer; wherein, the heat dissipation coating includes a filling member and a bonded member, the filling member is mixed in the bonded member. The filling member includes graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride, or a combination thereof. The present invention can quickly dissipate the heat generated by the heat source to the outside, and improve the heat dissipation performance of the electronic device.