• 专利标题:   Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.
  • 专利号:   WO2022243893-A1, DE102022204960-A1, US2023007788-A1
  • 发明人:   NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A
  • 专利权人:   MELLANOX TECHNOLOGIES LTD, UNIV BARILAN, PCB TECHNOLOGIES LTD, PCB TECHNOLOGIES LTD, UNIV BARILAN, MELLANOX TECHNOLOGIES LTD
  • 国际专利分类:   B32B015/04, B32B037/12, B32B007/12, B32B009/00, C01B032/182, H05K001/02, H05K001/03, H05K003/46, H05K003/06
  • 专利详细信息:   WO2022243893-A1 24 Nov 2022 H05K-001/02 202301 Pages: 36 English
  • 申请详细信息:   WO2022243893-A1 WOIB054617 18 May 2022
  • 优先权号:   US201910P, US305223

▎ 摘  要

NOVELTY - Method of creating a conductive-lubricant-coated printed circuit board (PCB) comprises: providing a lamination stack, where the process to create the lamination stack comprises providing a core; applying an adhesive layer to a top surface of the core; and attaching a conductive-lubricant-metal structure to the top surface of a core through the adhesive layer, where the conductive-lubricant-metal structure comprises a metal layer having at least one of a top surface of conductive-lubricant or a bottom surface of conductive- lubricant; and applying a heat and a pressure to the lamination stack to form the conductive-lubricant-coated PCB. USE - The method is used for creating a conductive-lubricant-coated printed circuit board (PCB). ADVANTAGE - The method removes one or more conductive-lubricant-metal structures (graphene-metal structures or hexagonal boron nitride-metal structures) from a PCB without causing tearing or damage to the underlying conductive-lubricant layer. The method provides higher frequency performance, heat management of PCBs, high thermal conductivity of PCBs, and electron mobility within the PCBs. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1)a method for removing a layer of metal layer from a lamination stack or a metal layer from a lamination stack, comprising: generating a lamination stack by: providing a core; applying an adhesive layer to a top surface of the core; attaching a first conductive-lubricant-metal structure to the top surface of the core through the adhesive layer, where the first conductive-lubricant-metal structure comprises a metal layer having at least a top surface of conductive-lubricant or a bottom surface of conductive- lubricant; and attaching a second conductive-lubricant-metal structure to a top surface of the first conductive-lubricant-metal structure, where the conductive-lubricant-metal structure comprises a second metal layer having at least a top surface of conductive-lubricant or a bottom surface of conductive-lubricant; applying compression and heat to the lamination stack to form a PCB or applying heat and pressure to the lamination stack to form a PCB; and displacing the bottom surface of conductive-lubricant of the second conductive-lubricant-metal structure from the top surface of conductive-lubricant of the conductive-lubricant-metal structure so as to remove the second conductive-lubricant-metal structure from the PCB; and/or applying heat and pressure to the lamination stack to form a PCB, and removing at least the portion of the second metal layer from the PCB; and (2)a printed circuit board (PCB) comprising a core, an adhesive layer applied to a top surface of the core, and at least one conductive-lubricant-metal structure attached to the top surface of the core via the adhesive layer, where the at least one conductive-lubricant-metal structure comprises a metal layer having conductive-lubricant on at least one of a top surface of the metal layer or a bottom surface of the metal layer, where the core, the adhesive layer, and the at least one conductive-lubricant-metal structure are heated and pressurized to form the PCB.