• 专利标题:   Flexible heat-dissipating adhesive sheet comprises thermally conductive adhesive layer formed on one surface of copper sheet and graphene layer formed on other surface of copper sheet in which graphene and synthetic resin are mixed.
  • 专利号:   KR2023034040-A, KR2545691-B1
  • 发明人:   HEE L J, HEE L Y, CHOIJINHO
  • 专利权人:   DONG WON INTECH CO LTD
  • 国际专利分类:   C08K003/04, C09J011/04, C09J007/28, C09J007/30, C09J009/00
  • 专利详细信息:   KR2023034040-A 09 Mar 2023 C09J-007/30 202324 Pages: 9
  • 申请详细信息:   KR2023034040-A KR117143 02 Sep 2021
  • 优先权号:   KR117143

▎ 摘  要

NOVELTY - Flexible heat-dissipating adhesive sheet comprises a thermally conductive adhesive layer formed on one surface of a copper sheet (110), and a graphene layer formed on the other surface of the copper sheet in which graphene and synthetic resin are mixed. USE - Used as flexible heat-dissipating adhesive sheet. ADVANTAGE - The adhesive sheet has excellent heat dissipation performance and a very thin thickness; realizes a thin heat dissipation; is easy to manufacture and economical; and realizes flexibility while securing vertical thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing flexible heat-dissipating adhesive sheet. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating the method for manufacturing a copper sheet in a method of manufacturing a flexible heat dissipating adhesive sheet. 110Copper sheet