• 专利标题:   Heat dissipation adhesive useful in heat dissipation tape for spreading heat generated from heat source in electronic device, display and smartphone, comprises graphene mixed with adhesive made of polymer material.
  • 专利号:   KR2020132237-A
  • 发明人:   KIM I S, YOON S R, HAN K, PARK B M, GEUN C J
  • 专利权人:   UI CO LTD, UNIV DANKOOK IND ACADEMIC COOP FOUND
  • 国际专利分类:   C08K003/04, C09J011/04, C09J133/00, C09J007/28, C09J007/38, C09J009/00, H05K007/20
  • 专利详细信息:   KR2020132237-A 25 Nov 2020 C09J-009/00 202099 Pages: 20
  • 申请详细信息:   KR2020132237-A KR057425 16 May 2019
  • 优先权号:   KR057425

▎ 摘  要

NOVELTY - Heat dissipation adhesive comprises graphene mixed with adhesive made of polymer material, and having both adhesion and thermal conductivity. USE - The heat dissipation adhesive is useful in heat dissipation tape for spreading heat generated from heat source in electronic device, and to diffuse heat generated from heat source in electronic devices, and in display and smartphone (all claimed). ADVANTAGE - The adhesive greatly reduces thickness by simplifying entire hierarchical structure by thermally conductive adhesive layer made of mixture of polymer adhesive and graphene powder, and cuts heat transfer in the heat transfer path from the heat source of the electronic device to the copper sheet, and significantly improves the heat dissipation performance by removing the polymer adhesive layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for heat dissipation tape comprising an adhesive sheet for receiving heat from a heat source, and a heat dissipation adhesive comprising a thermally conductive adhesive layer formed by laminating on one surface of the adhesive sheet to have adhesive strength and thermal conductivity.