• 专利标题:   P-type transparent conductor with highly reduced graphene oxide thin film, has substrate and highly reduced graphene oxide thin film deposited on the substrate, in which the film is directly grown on substrate by pulsed laser deposition.
  • 专利号:   IN202141012055-A, WO2022201184-A1
  • 发明人:   RAO R M S, JUVAID M M, SARKAR S, VENKATESAN T
  • 专利权人:   INDIAN INST TECHNOLOGY MADRAS, UNIV SINGAPORE NAT, INDIAN TECHNOLOGY MADRAS INST
  • 国际专利分类:   C23C014/28, C30B023/02, H01L021/02, H01L031/18, H01L051/42, H01L031/00, H01L033/42
  • 专利详细信息:   IN202141012055-A 23 Sep 2022 C23C-014/28 202282 Pages: 28 English
  • 申请详细信息:   IN202141012055-A IN41012055 21 Mar 2021
  • 优先权号:   IN41012055

▎ 摘  要

NOVELTY - P-type transparent conductor with a highly reduced graphene oxide thin film, comprises: a substrate; and a highly reduced graphene oxide thin film deposited on the substrate, where the reduced graphene oxide thin film is directly grown on the substrate by pulsed laser deposition in a reduced atmosphere. The substrate comprises silica/silicon and/or fused silica. USE - Used as P-type transparent conductor with a highly reduced graphene oxide thin film. ADVANTAGE - The conductor: is synthesized by direct growth of large-area wafer-scale highly reduced graphene oxide thin films in a single step pulsed laser deposition process, where the direct growth of large-area wafer-scale measures at least 4-inch diameter and the highly reduced graphene oxide thin film exhibits a transmittance value of ~98% at 550 nm and an electrical conductivity of ~7000 S/m (ρ is 0.014 Ω -cm); and has higher of the specification2contents leading to the reduction of resistivity (and sheet resistance) of the film and shows very high transmittance value. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for synthesis of p-type transparent conductor with reduced graphene oxide thin films. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of atomic force microscopy image of the highly reduced graphene oxide thin film grown on silica/silicon substrate for evaluating the thickness of the film.