▎ 摘　　要

NOVELTY - Printable transparent stress sensor comprises a conductive layer and an elastic substrate, where conductive layers is transparent conductive films composed of conductive nanomaterials, the elastic substrate is at-least twotransparent elastic layers with a modulus gradient structure, the transparent conductivity layer is embedded in the elastic substrate and connected to the highest modulus layer. USE - The printable transparent stress sensor useful in screen fingerprint unlocking of flexible touch screens, transparent wearable devices, for detecting human motion signals including small deformation signals e.g. pulse beating and large strain e.g. signals finger/knee bending (all claimed). ADVANTAGE - The printable transparent stress sensor: has large working range, high sensitivity, high light transmittance, high surface flatness and excellent tensile stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing printable transparent stress sensor comprising (i) mixing conductive nano material with solvent, subjecting to ultrasonic oscillation to disperse uniformly and using printing method to prepare transparent conductive film on the glass substrate, (ii) taking elastomer materials with large modulus differences and similar elongation at break, mixing to different proportions to obtain elastomer solution or precursor with different modulus, as elastomer substrate material, (iii) spreading the elastomer solution or precursor solution obtained in step (ii) on the surface of the conductive film from high to low, sequentially and evaporating the solvent or curing, forming an elastic matrix with modulus gradient embedded with transparent conductive film and (iv) tearing off the elastic substrate embedded with the transparent conductive film from the glass substrate obtained in step (iii) to obtain final product. DESCRIPTION OF DRAWING(S) - The drawing shows transparent stress sensor structure schematic diagram. 1Transparent conductive layer 2High modulus elastic substrate layer 3Middle-modulus elastic substrate layer 4Low modulus elastic substrate layer