▎ 摘　　要

NOVELTY - The utility model relates to the technical field of circuit board, specifically to a circuit board based on high heat glue protection, comprising a base, a substrate connected to the base, a heat conducting layer set on the surface of the base plate, a radiating layer coated on the heat conducting layer and a printed circuit printed on the radiating layer; the radiating layer is uniformly distributed with radiating micro-pores, the radiating layer is composed of a coating layer formed by graphene layer and ceramic mixed layer, the radiating micropores are uniformly distributed on the ceramic mixed layer, between the printed circuit and the radiating layer is provided with an insulating heat conducting glue, the graphene layer is sprayed on the surface of the heat conducting layer, the ceramic mixed layer is set on the surface of the graphene layer; the printed circuit is set on the surface of the ceramic mixed layer; The utility model uses the substrate matched with the heat conducting layer, and the surface of the heat conducting layer is coated with a radiating layer and then the printed circuit is printed on the surface of the radiating layer to form a circuit board, which solves the problem that the traditional circuit board has bad radiating effect.