▎ 摘　　要

NOVELTY - Porous metal type conductive adhesive film, comprises an upper adhesive layer, an ultra-thin porous metal layer and a lower adhesive layer, and the ultra-thin porous metal layer is formed between the upper adhesive layer and the lower adhesive layer, where the total thickness of the conductive adhesive film is 40-80 μm, the thickness of the upper adhesive layer is 20-40 μm, the thickness of the lower adhesive layer is 20-40 μm, and the thickness of the ultra-thin porous metal layer is 2-15 μm; the ultra-thin porous metal layer is porous metal silver-plated copper foil or porous metal gold-plated copper foil; and the through-hole density of the ultra-thin porous metal layer is 10000-15000/cm2, and the through-hole diameter is 1-100 m. USE - Used as porous metal type conductive adhesive film. ADVANTAGE - The porous metal type conductive adhesive film: has excellent electrical properties, excellent bonding strength, excellent solderability, excellent reliability, and excellent flame resistance; and has better conduction effect and bonding strength compared with ordinary conductive adhesives. The production is easy to realize. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing porous metal type conductive adhesive film comprising either (i) sieving and mixing metal conductive particles of various shapes evenly, (ii) adding metal conductive particles and adhesive resin in order and proportion and mixing, (iii) coating the mixture obtained in step (ii) on the designated release surface of the release film to obtain adhesive layer, (iv) pasting the coated product of curing step (iii) on one side of the ultra-thin porous metal foil, (v) laying the coated product of step (iii) on the other side of the ultra-thin porous metal foil, and (vi) curing, winding and slitting to obtain final product; or (i) sieving and mixing various shapes of conductive metal particles evenly, (ii) adding metal conductive particles and adhesive resin in order and mixing, (iii) coating the mixture prepared in step (ii) on the designated release surface of the release film to obtain adhesive layer, (iv) pasting the coated product of curing step (iii) on one side of the ultra-thin porous metal foil, (v) coating an adhesive layer on the other side of the ultra-thin porous metal foil, and (vi) curing, winding and slitting to obtain final product.