• 专利标题:   Heat transfer assembly for use in electronic device, has overlapped set of graphene layer and heating layer, where heating layer comprises circuit for graphene and heating, and graphene is electrically isolated graphene layer.
  • 专利号:   CN217884265-U
  • 发明人:   MIAO Y, ZHANG F, GUO J
  • 专利权人:   GUANGZHOU ASENSING ELECTRONICS CO LTD
  • 国际专利分类:   H05K007/20
  • 专利详细信息:   CN217884265-U 22 Nov 2022 H05K-007/20 202297 Chinese
  • 申请详细信息:   CN217884265-U CN21111727 09 May 2022
  • 优先权号:   CN21111727

▎ 摘  要

NOVELTY - The application claims a heat transfer assembly and an electronic device, relating to the field of electronic device. the heat transfer assembly comprises an overlapping set of the graphene layer and a heating layer, wherein the heating layer comprises graphene circuit for electrifying and heating, the circuit is graphene isolated graphene the layer. Because the graphene has excellent heat conducting performance, when attached to the heating device of the electronic device, it can realize soaking, eliminating hot spot. the heat of the heating device is easy to be conveyed to the heated surface (such as shell, radiating fin and so on) through the heat transfer assembly, so the radiating effect is good. In addition, the graphene has good conductivity, and the electric heating conversion efficiency is high, therefore, using the graphene to electrify and heat, the heating efficiency is high and the effect is good. Therefore, the application transfer assembly provided by the embodiment of the invention can well give consideration to the radiating function and heating function. The electronic device provided by the application comprises the heat transfer assembly. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device.