▎ 摘　　要

NOVELTY - Peeling layer comprises a barrier layer on the carrier copper foil, a conductive layer on the barrier layer, and a crystalline layer on the conductive layer, and the ultra-thin copper foil is formed on the crystalline layer, where the barrier layer is a nitrogen-containing compound, a sulfur-containing compound or a carboxylic acid, and the thickness is 50-500 nm. The conductive layer is a conductive polymer, graphene oxide, graphene or multi-layer graphite, and the thickness is 50-500 nm. The crystal layer is an organic metal complex or a metal organic framework compound, and the thickness is 200-500 nm. USE - The peeling layer is useful for preparing ultra-thin copper foil. ADVANTAGE - The ultra-thin copper foil plating layer is fine and flat, easy to separate after pressing with the carrier copper foil, satisfies high conductivity of the metal layer, and has fine and uniform organic layer peeling. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of ultra-thin copper foil based on the peeling layer.