▎ 摘　　要

NOVELTY - The method involves forming a circuit pattern of porous LIG (20) on a polymer material layer (10). Metal nanoparticles are deposited on the LIG so as to serve as metal seed. The circuit pattern is pressed. A metal layer is formed on the LIG by one of electroplating, electroless plating, and sputtering. USE - Manufacturing method for polymer PCB. ADVANTAGE - The method adheres the circuit pattern on the material layer securely and obtains outstanding electric conductivity on the circuit pattern after the circuit pattern is pressed. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic view of a polymer PCB. Material layer (10) LIG (20)