▎ 摘　　要

NOVELTY - Preparing flexible colorless transparent polyimide composite structure involves dissolving diamine and dianhydride in a mole ratio of 1:0.95-1.05 in the non-proton polar solvent and uniformly stirring for 10-20 hours. The end capping agent is added and continuously stirred for 3-8 hours to generate polyamic acid solution. The dehydrating agent and catalyst are added to the polyamic acid solution to finish the chemical imidization reaction and reacted for 10-20 hours to generate polyimide glue solution. The polyimide glue solution is separated and dried in de-ionized water or ethanol to obtain the polyimide resin. The polyimide resin is dissolved in the non-proton polar solvent to obtain the polyimide resin glue solution. The polyimide resin glue solution is vaccum defoamed for 1-10 hours, uniformly coated on the glass plate, placed in the oven to heat at 150-300 degrees C, when the temperature of the oven is reduced to 25 degrees C. USE - Method for preparing flexible colourless transparent polyimide composite structure. ADVANTAGE - The method has low oxygen transmission rate, low water vapor transmission rate, low thermal expansion coefficient and high visible light transmittance. DETAILED DESCRIPTION - Preparing flexible colorless transparent polyimide composite structure involves dissolving diamine and dianhydride in a mole ratio of 1:0.95-1.05 in the non-proton polar solvent and uniformly stirring for 10-20 hours. The end capping agent is added and continuously stirred for 3-8 hours to generate polyamic acid solution. The dehydrating agent and catalyst are added to the polyamic acid solution to finish the chemical imidization reaction and reacted for 10-20 hours to generate polyimide glue solution. The polyimide glue solution is separated and dried in de-ionized water or ethanol to obtain the polyimide resin. The polyimide resin is dissolved in the non-proton polar solvent to obtain the polyimide resin glue solution. The polyimide resin glue solution is vaccum defoamed for 1-10 hours, uniformly coated on the glass plate, placed in the oven to heat at 150-300 degrees C, when the temperature of the oven is reduced to 25 degrees C. The glass plate is taken out to obtain the flexible colorless transparent polyimide film. The flexible colorless transparent polyimide film is processed to generate a buffer layer with the thickness of less than 150 nanometer (nm). The layer of polyimide resin glue solution is coated on the surface of the buffer layer, placed into the oven at 150-300 degrees C, when the temperature of the oven is reduced to 25 degrees C. The flexible colorless transparent polyimide composite structure is obtained.