• 专利标题:   Preparing conductive acrylic pressure-sensitive adhesive useful in electronic industry, comprises e.g. ultrasonically dispersing nano-composite particles in butyl acrylate, adding dodecyl mercaptan and beta-carboxyethyl acrylate, performing secondary heating and stirring, and cooling.
  • 专利号:   CN115851167-A
  • 发明人:   LI X, WANG S, JIN X
  • 专利权人:   JIANGSU SHRETEC MATERIAL TECHNOLOGY CO
  • 国际专利分类:   C08F002/44, C08F220/14, C08F220/18, C08F220/28, C08F220/58, C08K003/04, C08K003/22, C08K009/06, C08K009/12, C09J133/08, C09J133/12, C09J009/02
  • 专利详细信息:   CN115851167-A 28 Mar 2023 C09J-009/02 202337 Chinese
  • 申请详细信息:   CN115851167-A CN11059529 01 Sep 2022
  • 优先权号:   CN11059529

▎ 摘  要

NOVELTY - Preparing conductive acrylic pressure-sensitive adhesive comprises adding nano-composite particles into butyl acrylate, ultrasonically dispersing to obtain composite butyl acrylate, uniformly mixing composite butyl acrylate, 2-ethylhexyl acrylate and methyl methacrylate and adding to the aqueous solution to obtain composite acrylic acid aqueous solution, adding 2-acrylamido-2 methylpropanesulfonate ammonium salt into the aqueous solution to obtain emulsifier aqueous solution; (ii) dropping composite acrylic acid aqueous solution and emulsifier aqueous solution into reaction container, and dropping half of persulfuric acid sodium solution, heating and stirring at one time, adding dodecyl mercaptan and β-carboxyethyl acrylate, dripping other half of sodium persulfate solution, performing secondary heating and stirring, and cooling to obtain the conductive acrylic pressure-sensitive adhesive. USE - The method is useful for preparing conductive acrylic pressure-sensitive adhesive used in electronic industry. ADVANTAGE - The conductive acrylic pressure-sensitive adhesive: has improved wettability, bonding strength, water resistance and initial viscosity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for conductive acrylic pressure-sensitive adhesive, is obtained by the above method.