▎ 摘　　要

NOVELTY - Heat dissipation film comprises two-dimensional heat conduction elements assembled in an orientation, and is prepared by (i) dispersing the two-dimensional heat conduction elements and gel components in water to form an assembly liquid, where the concentration of the two-dimensional heat conduction element is below 20 vol.%, (ii) placing the planar substrate that can release charged particles in the assembly liquid, and assembling the two-dimensional heat conduction element along the orientation of the substrate surface, and (iii) removing the substrate to obtain the film, where the assembly unit can form an electrostatic interaction with the charged particles, and the gel component is capable of forming a gel under the induction of the charged particles. USE - Heat dissipation film. ADVANTAGE - The film can reach the thickness of more than 25μm, and adopts simple operation, and is economical, and the in-plane thermal conductivity reaches 15.5 W/(m*K), and has compressibility, and stable effect, and can be further processed to make its in-plane thermal conductivity reach 50.9 W/(m*K).