▎ 摘　　要

NOVELTY - The apparatus (1) has a first layer (3) comprising a first coefficient of thermal expansion to support a layer of two dimensional material (7). A second layer (5) is coupled to the first layer, and comprises a second coefficient of thermal expansion. The first coefficient of thermal expansion is different to the second coefficient of thermal expansion such that change in temperature causes deformation of a part of the apparatus and the deformation for enabling transfer of the two dimensional material. USE - Apparatus for enabling transfer of two dimensional materials e.g. graphene, hexagonal boron nitride and molybdenum disulphide, in a microelectronic device e.g. thin film transistor, transducer and sensor, at a roll to roll manufacturing application. ADVANTAGE - The apparatus enables transfer to be carried out at low temperatures without wet processing to reduce risk of damaging or contaminating the two dimensional material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for enabling transfer of two dimensional materials. DESCRIPTION OF DRAWING(S) - The drawing shows a block diagram of an apparatus for enabling transfer of two dimensional materials. Apparatus for enabling transfer of two dimensional materials (1) Layers (3, 5) Two dimensional material (7)