▎ 摘　　要

NOVELTY - Grinding pad comprises a grinding layer and a backing layer. The raw material layer is: 35-55 wt.% liquid resin bonding agent, 0-35 wt.% reactive diluent, 5-25 wt.% grinding material, 5-30 wt.% filler, 5-20 wt.% photocatalyst, 5-30 wt.% curing agent, 0.5-5 wt.% initiator, and 0.5-5 wt.% other auxiliary agent. USE - The grinding pad is useful for photo-catalytic auxiliary chemical mechanical polishing. ADVANTAGE - The grinding pad has simple preparation process, high material removal rate, small workpiece surface roughness, high utilization rate of abrasive particles and photocatalyst, and is environmentally friendly when processing silicon carbide (SiC) wafers under ultraviolet light irradiation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the grinding pad, comprising dispersing the raw materials of the grinding layer, defoaming, casting in the mold, scraping the surface, spreading layer of backing layer on the surface of the scraped side, light-cure or heat-cure, and demolding, pasting backing layer on the surface of the backing layer away from the grinding layer, or pasting second backing layer and backing layer in sequence.