▎ 摘　　要

NOVELTY - Copper/graphene composite film material is cliamed. The copper/graphene composite film material is prepared by adding a single-layer graphene dispersion to basic electroless copper plating solution by using an ultrasonic-assisted electroless plating method to co-deposit metallic copper and single-layer graphene on the surface of the substrate, where where the double complexing agent is composed of potassium sodium tartrate and disodium ethylenediaminetetraacetic acid with a mass ratio of 1/2-1, the sheet diameter of the single-layer graphene is 0.5-5 microm. USE - The copper/graphene composite film material is useful: as a high thermal conductivity material: and in electroless copper plating industry (all claimed). ADVANTAGE - The copper/graphene composite film material of the present invention has uniform growth distribution and good stability. The method: makes the metal copper on the surface of the material densely packed with the single-layer graphene, thus making the surface free of holes, having high density and uniform crystal grain shape. DETAILED DESCRIPTION - Copper/graphene composite film material is cliamed. The copper/graphene composite film material is prepared by adding a single-layer graphene dispersion to basic electroless copper plating solution by using an ultrasonic-assisted electroless plating method to co-deposit metallic copper and single-layer graphene on the surface of the substrate, when the mass of copper sulfate pentahydrate per liter of basic electroless copper plating solution is 5-14 g, the mass of double complexing agent is 17-51 g, the mass of sodium hydroxide is 10-13 g, the volume of formaldehyde is 10-25 ml, the mass of 2,2-bipyridine is 10-30 mg and the mass of single-layer graphene is 0.1-2 g, the balance is deionized water, the obtained copper/graphene composite film material has thermal conductivity of up to 501.45 W/(m.K), where the double complexing agent is composed of potassium sodium tartrate and disodium ethylenediaminetetraacetic acid with a mass ratio of 1/2-1, the sheet diameter of the single-layer graphene is 0.5-5 microm. An INDEPENDENT CLAIM is also included for preparing a copper/graphene composite film material using an ultrasonic-assisted chemical plating method, comprising (a) introducing the copper sheet substrate into a beaker filled with deionized water for ultrasonic cleaning for 3-5 minutes, placing it in an alkaline washing solution at 50-60degrees Celsius for 3-5 minutes, taking it out and rinsing with deionized water, introducing it into dilute hydrochloric acid at room temperature and allowing it to stand for 20-40seconds, finally rinsing with deionized water and blow drying, where the alkaline washing solution is prepared by adding 10-30 g trisodium phosphate, 10-30 g sodium carbonate and 5-10 g sodium hydroxide per liter of deionized water and the concentration of the dilute hydrochloric acid is 0.05-0.1 mol/liter, (ii) taking 5-14 g copper sulfate pentahydrate, 17-51 g of double complexing agent, 10-13 g sodium hydroxide and 10-30 mg stabilizer per liter of deionized water and introducing them in a beaker containing deionized water to obtain a basic electroless copper plating solution, (iii) taking 0.1-2 g single-layer graphene per liter of deionized water and placing it in a beaker filled with deionized water for ultrasonic stirring treatment for 2 hours, then adding the mixed dispersant, sonicating and stirring for 2 hours, where the mixed dispersant is a combination of two or more of polyvinylpyrrolidone, chloroform, dimethylformamide and tetrahydrofuran, the quality of the added dispersant can be set to 3-8 times that of single-layer graphene according to the type of mixed dispersant to obtain a single-layer graphene dispersion, (iv) placing the beaker of the basic electroless copper plating solution prepared in step (ii) in a constant temperature water bath at 45-75degrees Celsius and stirring for 1-3 minutes to reach the corresponding electroless copper plating temperature, (v) adding 10 ml of single-layer graphene dispersion prepared in step (iii) into 240 ml of the basic electroless copper plating solution preheated in step (iv), stirring at 200-400 revolutions/minute to fully mix it with the basic electroless copper plating solution, then ultrasonically stirring the mixed plating solution for 3-7 minutes, then introducing it back into a constant temperature water bath at 45-75degrees Celsius for electroless copper plating, (vi) clamping the copper sheet substrate treated in step (i) with a clamp into the mixed electroless copper plating solution obtained in step (v), adding 10-25 ml reducing agent per liter of basic electroless copper plating solution while stirring, where the electroless copper plating time is 20-40 minutes and (vii) washing the copper/graphene composite film on the surface of the copper sheet obtained in step (vi) with deionized water, drying it with a hair dryer to obtain a copper/graphene composite film material.