▎ 摘　　要

NOVELTY - The method involves adding two raw materials of indium and zinc to a basic raw material. Ultrafine alloy silver wires are prepared by vacuum melting and magnetic suspension smelting. A copper plating layer is prepared on the surface of the ultrafine alloy silver wire by vapor deposition. Polystyrene is used as a carbon source to grow graphene on the surface of the copper plating layer to obtain a bonded silver wire containing graphene on the surface. The basic raw material has 0.3- 0.8 wt.% copper, 0.2-0.5 wt.% cerium, 0.05-0.09 wt.% palladium, 0.13-0.20 wt.% indium, 0.05-0.15 wt.% zinc and remaining is silver. USE - Method for preparing anti-oxidation bonding alloy silver wire containing graphene on surface in microelectronic packaging field. ADVANTAGE - The method has uniform components and good ductility, and improves the toughness and ductility of the bonding silver wire compared with the traditional process, the uniformity of the material and the oxidation resistance of the bonded silver wire, which has wide industrial popularization. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating the method for preparing anti-oxidation bonding alloy silver wire containing graphene on surface in microelectronic packaging field (Drawing includes non-English language text).