▎ 摘　　要

NOVELTY - The packaging structure has a heat radiation substrate (1) and a chip (3) bonded to an upper surface of the heat radiation substrate. A graphene conductive heat-radiating film (2) is formed between the upper surface of the heat-radiation substrate and the bottom surface of the chip. The bottom of the chip is adhered to the surface of graphene conductive radiating film through adhesive layer. The adhesive layer comprises a conductive adhesive, an insulating adhesive or an eutectic material. USE - Packaging structure for MPS diode. ADVANTAGE - The structure solves the problem that the power density of the chip is larger, and the copper base heat dissipation capacity is insufficient, which causes the chip to be damaged due to overheating. The structure adopts the chemical vapor deposition method to deposit the graphene conductive heat dissipation film with good conductivity, thermal diffusion and heat radiation ability on the copper substrate of the power dissipating substrate the MPS diode, and can not affect the electrical characteristics of the MPS. The structure greatly improves the device's cooling capacity, reduces device thermal resistance and junction temperature. The thermal performance of the device is improved by virtue of the excellent surface heat radiation performance of graphene. The quality of graphene obtained by the self-propagating process is good, and the graphene has good contact with the copper base of MPS, and the heat dissipation is much better. The structure is applied to the substrate needs to be conductive even a high degree of transparency of the occasion with a wide range of industrial prospects. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a packaging method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the packaging structure. Heat radiation substrate (1) Graphene conductive heat-radiating film (2) Chip (3) Top electrode (4) Bottom electrode (5)