▎ 摘　　要

NOVELTY - The utility model claims a high-efficiency radiating printed circuit board structure, wherein it comprises a substrate and printed is orderly provided with conductive printed pattern layer and an insulating layer on the upper surface of the substrate; the lower surface of the substrate is provided with a heat conducting plating layer, the lower surface of the heat conducting plating layer provided with the graphene layer, lower surface of said graphene layer with a ceramic radiating layer; the substrate is provided with a radiating hole, the plate body of said heat dissipation hole penetrating the substrate. forming a first heat transfer means as main heat dissipation structure through heat conducting plating layer, a graphene layer and ceramic heat dissipation layer, then forming the second heat transmission method through the heat dissipation column of the multilayer, the core heat quickly transmitted to each layer of the structure can be radiated.