• 专利标题:   Heat-conducting covering film for electronic device, has heat transfer layer whose upper surface is coated with high temperature resistant processing layer, and adhesive layer set between phase change layer and release film.
  • 专利号:   CN215365593-U
  • 发明人:   HE G, LIANG F, WU X, XIA Y, LIU X
  • 专利权人:   SHENZHEN GELIN YAMING IND CO LTD
  • 国际专利分类:   C09J007/29, C09J007/40, C09K005/06
  • 专利详细信息:   CN215365593-U 31 Dec 2021 C09K-005/06 202256 Chinese
  • 申请详细信息:   CN215365593-U CN21085438 19 May 2021
  • 优先权号:   CN21085438

▎ 摘  要

NOVELTY - The utility model claims a heat-conducting covering film, comprising a heat transfer layer, a first adhesive layer, a phase change layer, a second adhesive layer and a release film are orderly set; the upper surface of the heat transfer layer is coated with a high temperature resistant processing layer; the first adhesive layer is disposed between the heat transfer layer and the phase change layer; the second adhesive layer is set between the phase change layer and the release film; the phase change layer is uniformly provided with graphene. The heat conducting covering film of the utility model has good radiating function.