▎ 摘　　要

NOVELTY - A low-silver content composite conductive silver paste comprises 5-15 pts. wt. graphene microchips, 30-50 pts. wt. silver-plated glass powder, 5-15 pts. wt. polymer resin, 20-40 pts. wt. high-boiling point organic solvent, 1-4 pts. wt. leveling agent and 0.1-1.5 pts. wt. defoaming agent. USE - Low-silver content composite electroconductive silver paste is used for forming electroconductive film. ADVANTAGE - The low-silver content composite conductive silver paste has high conductivity and bulk density. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low-silver content composite electroconductive silver paste.