▎ 摘　　要

NOVELTY - The method involves combining a sensitive element (b) to a surface of a flexible substrate (a). A lead groove (d) is marked on the surface of the flexible substrate. A lead (e) i.e. flexible thin copper wire, is arranged in the lead groove. An end of the lead is overlapped with the sensitive element. A conductive adhesive is coated and solidified on an adhesive point (c) of the sensitive elements. The conductive plastic is injected into the lead groove. The lead is wrapped until the lead groove is filled. An upper packaging layer (f) is prepared. The flexible microelectronic sensor is completed. The sensitive element is selected from zinc oxide, tin oxide, gallium oxide and other non-transition metal oxide or metal nano wire, carbon nano-tube, graphene and other low-dimensional structure material. The sensitive element is laser-induced graphene. The flexible substrate is polydimethylsiloxane. USE - Packaging method of flexible microelectronic sensor. ADVANTAGE - The method enables reducing the lead falling possibility, improve the packaging reliability, so enables the user to quickly and conveniently realize the packaging of the flexible microelectronic sensor in the scientific laboratory environment. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of a flexible microelectronic sensor. aflexible substrate bsensitive element cadhesive point dlead groove eLead