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  • 专利标题:   Thermal interface material (TIM) pad for dissipating heat from component in electronic device such as data storage device, has TIM layers, and graphene layer which is interposed between TIM layers.
  • 专利号:   US2014328024-A1, WO2014179621-A1, AU2014259751-A1, KR2016005081-A, CN105324843-A, EP2992552-A1, US9338927-B2, AU2014259751-B2, EP2992552-A4, AU2017202424-A1, HK1220286-A0, CN105324843-B
  • 发明人:   MATAYA R A, SALESSI N M, SALEESI N M
  • 专利权人:   MATAYA R A, SALESSI N M, WESTERN DIGITAL TECHNOLOGIES INC, WESTERN DIGITAL TECHNOLOGIES INC
  • 国际专利分类:   B23P015/26, F28F003/08, H05K007/20, H01L023/36, H01L023/40, H01L029/16, H01L000/00, H05K000/00
  • 专利详细信息:   US2014328024-A1 06 Nov 2014 F28F-003/08 201474 Pages: 9 English
  • 申请详细信息:   US2014328024-A1 US913068 07 Jun 2013
  • 优先权号:   US818756P, US913068, AU259751, WOUS036455, CN80031558, AU202424

▎ 摘　　要

NOVELTY - The TIM pad (210) has TIM layers, and at least one graphene layer (214) interposed between TIM layers. The graphene layer extends in a direction substantially perpendicular to the surface of the component (220), such that the thermal conductivity of the TIM pad is greater in the direction substantially perpendicular to the surface of the component than in a direction substantially parallel to the surface of the component. USE - TIM pad for dissipating heat from component in electronic device such as data storage device (claimed). ADVANTAGE - Improves thermal efficiency of the TIM pad by filling air gaps along a frame or component surface. Allows for the thermal conductivity of the TIM pad to be increased in the direction substantially perpendicular to the surface of the component and thus improving heat conduction through the TIM pad. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a heat dissipation method from component of electronic device; and (2) a data storage device. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-section view of a TIM pad compressed between a frame and a component. TIM pad (210) Graphene layer (214) Component (220) Solder balls (222) Printed circuit board (224) Frame (230)