▎ 摘　　要

NOVELTY - The heat conductive device (1) comprises a heat conductive unit (11) provided with a closed chamber (111), and a wick structure (12) arranged on an inner side surface of the closed chamber. A heat transferring unit (13) has multiple heat conductive elements agglomerated into islands and separated from each other, where the heat conductive elements are arranged on a partial surface of the wick structure. A heat conductive fluid (14) is arranged in the closed chamber, and a partition component (15) is arranged between the two metal plates. The wick structure is arranged on an inner side surface of a tubular body. The material of the heat conductive element has graphene, or carbon nanotubes. USE - Heat conductive device for use in an electronic device (claimed), such as mobile phones, tablets, notebook computers, or servers. ADVANTAGE - The heat conductive device has a higher heat conductive efficiency, and rapidly transfers and dissipates the heat energy generated by the heat source of the electronic device to the environment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for: (a) an electronic device comprising a heat source. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a heat conductive device. Heat conductive device (1) Heat conductive unit (11) Wick structure (12) Heat transferring unit (13) Heat conductive fluid (14) Partition component (15) Closed chamber (111)