▎ 摘　　要

NOVELTY - The structure has a metal interconnect line including an upper surface and a side surface on a substrate. A graphene layer is placed on the upper surface and the side surface of the metal interconnects line. A dielectric layer on the substrate covers a portion of a graphene layer on the side surface of the metal interconnects line. The dielectric layer does not cover a portion of the graphene layer on the upper surface of the metal interconnect line. A next dielectric layer is placed on the dielectric layer for forming a next interconnect structure. USE - Interconnect structure. ADVANTAGE - The structure prevents metal in a metal interconnection from diffusing into the dielectric layer, and provides a high oxidation resistance of the graphene layer to prevent the graphene layer from being oxidized when the graphene layer is exposed to air, and prevents the metal interconnect line from being oxidized by the air, thus improving a reliability of the device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for manufacturing an interconnect structure. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of an intermediate stage of an interconnect structure. Dielectric layers (201, 202) Barrier layers (301, 302) Hardmask (401) Though-hole (402) Opening (422)