▎ 摘　　要

NOVELTY - The method involves alternately stacking a graphene oxide film and a clapboard. Temperature of the graphene oxide film and the clapboard is controlled. Predetermined pressure in direction vertical to the graphene oxide film and the clapboard is applied. Graphene oxide film thermal reduction and compacting process is completed in a protective atmosphere through program temperature and program pressure to obtain a high-density thermal reduction graphene oxide film, where protective gas comprises nitrogen, argon gas, hydrogen, carbon dioxide or mixed gas, and a material of the clapboard comprises a carbon steel, an alloy steel graphite ceramic, and glass in combination. USE - Method for manufacturing a heat conducting and radiating material for a high-density graphene oxide film used in a thermal management system of an electronic device. Uses include but are not limited to vacuum filtration, scraping, spin coating, dip coating, electrostatic self-assembly and centrifugal casting processes. ADVANTAGE - The method enables efficiently and quickly preparing the graphene oxide film, so that the graphene oxide film has high density, high heat conductivity and better appearance without calendaring and densifying, and production of the graphene oxide film is efficient. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a high-density thermal reduction graphene oxide film.