• 专利标题:   Dielectric filter frequency modulation repair adhesive comprises o-cresol novolac epoxy resin, diluent, latent curing agent, wetting and dispersing agent, defoamer, thixotropic agent, conductive additives and conductive silver powder.
  • 专利号:   CN112898932-A
  • 发明人:   JIANG W, CHANG M, YE R, LIANG X, WANG Y
  • 专利权人:   MOBI ANTENNA TECHNOLOGY SHENZHEN CO LTD, MOBI TECHNOLOGY SHENZHEN CO LTD, MOBI COMMUNICATION TECHNOLOGY JIAN CO LT, MOBI TECHNOLOGY XI AN CO LTD, SHENZHEN SHENGYU SMART NETWORK TECHNOLOG, XIAN MOBI ANTENNA TECHNOLOGY ENG CO LTD
  • 国际专利分类:   C09J163/04, C09J009/02
  • 专利详细信息:   CN112898932-A 04 Jun 2021 C09J-163/04 202158 Pages: 9 Chinese
  • 申请详细信息:   CN112898932-A CN10048813 14 Jan 2021
  • 优先权号:   CN10048813

▎ 摘  要

NOVELTY - Dielectric filter frequency modulation repair adhesive comprises 10-17 pts. wt. o-cresol novolac epoxy resin, 10-15 pts. wt. diluent, 0.5-1.5 pts. wt. latent curing agent, 0.2-0.5 pt. wt. wetting and dispersing agent, 0.2-0.5 pt. wt. defoamer, 0.3-0.6 pt. wt. thixotropic agent, 5-10 pts. wt. conductive additives, 4-7 pts. wt. low temperature alloy and 55-70 pts. wt. conductive silver powder. USE - Dielectric filter frequency modulation repair adhesive. ADVANTAGE - The repair adhesive forms cured film on the surface of the silver layer that needs to be repaired, so the cured film has excellent conductivity, reduces the waste of time and resources, and does not affect the heat resistance of the porcelain component in the dielectric filter, and avoids the risk of cracks in the porcelain component, and ensures excellent reliability and stability of the dielectric filter. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the repair adhesive, involving (a) dissolving o-cresol epoxy resin in diluent to form o-cresol epoxy resin slurry, (b) evenly stirring the wetting and dispersing agent, defoamer, thixotropic agent, low temperature alloy, conductive silver powder and o-cresol epoxy resin slurry in a ratio of (0.2-0.5):(0.2-0.5):(0.3-0.6):(4-7):(55-70):(20-32), leaving still for 10-20 minutes to form a mixed slurry (A), and evenly dispersing the mixed slurry (A), (c) adding latent curing agent and conductive additives to the dispersed mixed slurry (A) to obtain mixed slurry (B), and (d) evenly stirring the mixed slurry (B), and filtering to form mixed slurry (C).