▎ 摘　　要

NOVELTY - The assembly (200) has a first device mounted overlapping a second device i.e. memory device (204). A thermal management layer is coated between the first device and the second device. The thermal management layer reduces transfer of thermal energy between the first device and the second device. A connector (208) electrically couples the first and second devices. The connector extends across the thermal management layer. The first device is a logic device (202) and graphics processing unit (GPU). A thermally conductive layer (210) is formed as a graphene structure. A thermal-insulator interposer (214) includes ceramic, glass, or a combination. The thermal-insulator interposer includes a cavity (216). USE - Semiconductor assembly e.g. memory and processor for manufacturing smaller and faster devices with a high density components for computers, cell phones, pagers, personal digital assistants. ADVANTAGE - The assembly can provide a reduced footprint in comparison to conventional assemblies while reducing heat transfer between the logic device and the memory devices. The thermal-insulation interposer reduces or eliminates direct lines of sight between the logic device and the memory devices to block or impede heat generated by the logic device from reaching the memory devices. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a semiconductor assembly. Semiconductor assembly (200) Logic device (202) Memory devices (204) Connector (208) Thermally conductive layer (210) Thermal-insulation interposer (214) Cavity (216)