• 专利标题:   Preparation of thermal conductive gasket involves preparing template structure of graphene composite, removing template, filling with silica gel-containing filler to obtain sample, and encapsulating encapsulation layer on sample.
  • 专利号:   CN108913104-A
  • 发明人:   DING S, ZHOU X, LIU Z
  • 专利权人:   NINGBO INST MATERIALS TECHNOLOGY ENG C
  • 国际专利分类:   C09K005/14
  • 专利详细信息:   CN108913104-A 30 Nov 2018 C09K-005/14 201912 Pages: 9 Chinese
  • 申请详细信息:   CN108913104-A CN10681019 27 Jun 2018
  • 优先权号:   CN10681019

▎ 摘  要

NOVELTY - Preparation of thermal conductive gasket involves dipping, spraying or casting a graphene dispersion to a template, drying to obtain a template structure of graphene composite, removing the template from the template structure to obtain a three-dimensional film-like graphene network structure, filling the three-dimensional film-like graphene network structure with silica gel containing insulating and thermal conductive filler to obtain a thermal conductive gasket sample, and encapsulating an encapsulation layer on the sample. USE - Preparation of thermal conductive gasket (claimed). ADVANTAGE - The process effectively eliminates the defects of ordered arrangement of graphene to achieve the requirements of high thermal conductivity, and defects of insulation to achieve the test requirements of breakdown voltage.