▎ 摘　　要

NOVELTY - Heat conducting complex material comprises 60-90 pts. wt. phenolphthalein polyarylethernitrile, 0-40 pts. wt. graphene, 0-20 pts. wt. auxiliary fillers, 0-1 pts. wt. dispersant, 0-3 pts. wt. compatibilizer and 0-3 pts. wt. lubricant. The graphene is pure graphene, graphene oxide, carboxylated graphite and/or graphene aqueous slurry, the auxiliary filler is boron nitride, aluminum nitride, silicon carbide, carbon black, carbon fiber and carbon nanotube, the dispersant is stearic talide, stearic acid single glyceride and low molecular ionomer, the compatibilizer is KBM-403, KH550 and/or KH560, and the lubricant is PE wax, microcrystalline paraffin, and/or low molecular weight polypropylene. USE - The material is useful in the field of heat dissipation electronics (claimed). ADVANTAGE - The material replaces heat sink electronics, good thermal conductivity and mechanical properties. The method is simple. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the heat conducting complex material, comprising (i) taking phenolphthalein polyarylether nitrile ketone, graphene, an auxiliary filler, dispersant, compatibilizer and lubricant in a high-speed mixer and mixing uniformly to obtain mixture A; (ii) drying the mixture A at 120 degrees C for 2-3 hours to obtain a mixture B and (iii) placing the mixture B obtained in step (ii) in a mold, cold-pressing in a flat plate vulcanizer, taking out, adding into a high-temperature aging box, sintering at 320 degrees C for 40-50 minutes, cold-pressing in a flat plate vulcanizer and demolding.