• 专利标题:   High molecular heating plate comprises framework material and conductive filler; framework material comprises polyacrylate; conductive filler includes 3,4-difluoro-trans styrene isocyanate functionalized graphene.
  • 专利号:   CN114350092-A
  • 发明人:   CAI C, XUAN Z, LEI N, ZHANG X
  • 专利权人:   HANGZHOU ANYU TECHNOLOGIES CO LTD
  • 国际专利分类:   C08F220/14, C08F226/06, C08J005/18, C08K003/04, C08K009/04, C08L033/12, C08L039/04
  • 专利详细信息:   CN114350092-A 15 Apr 2022 C08L-033/12 202266 Chinese
  • 申请详细信息:   CN114350092-A CN10406792 15 Apr 2021
  • 优先权号:   CN10406792

▎ 摘  要

NOVELTY - High molecular heating plate comprises framework material and conductive filler; the framework material comprises polyacrylate; the conductive filler includes 3,4-difluoro-trans styrene isocyanate functionalized graphene. USE - Used as high molecular heating plate. ADVANTAGE - The high molecular heating plate: has excellent electrical conductivity and thermal conductivity, high electrothermal conversion efficiency, good heating uniformity, actively enhanced mechanical properties and thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the high molecular heating plate comprising carrying heteromolecular polymerization on functionalized graphene and MMA under the action of azobisisobutyronitrile (AIBN) catalyst.