• 专利标题:   Low silver composite solder with high tensile strength comprises matrix materials comprising tin-silver-copper, and graphene.
  • 专利号:   CN110936061-A
  • 发明人:   YIN L, ZHANG Z, ZUO C, YAO Z, JIANG S
  • 专利权人:   UNIV CHONGQING SCI TECHNOLOGY
  • 国际专利分类:   B23K035/30
  • 专利详细信息:   CN110936061-A 31 Mar 2020 B23K-035/30 202033 Pages: 10 Chinese
  • 申请详细信息:   CN110936061-A CN11326392 20 Dec 2019
  • 优先权号:   CN11326392

▎ 摘  要

NOVELTY - A low silver composite solder comprises matrix materials comprising tin-silver-copper, and 0.01-0.09 wt.% graphene. USE - Low silver composite solder. ADVANTAGE - The low silver composite solder with high tensile strength has excellent wetting performance, and solderability. DETAILED DESCRIPTION - A low silver composite solder comprises matrix materials comprising tin-silver-copper (Sn-0.3Ag-0.7Cu), and 0.01-0.09 wt.% graphene. An INDEPENDENT CLAIM is included for preparation of low-silver SAC composite solder with high tensile strength.