▎ 摘　　要

NOVELTY - A semiconductor sealing material composition comprises (wt.%): an epoxy resin (9-13); a hardener (6-7); a curing catalyst (0.2-0.3); at least one additive (0.60-0.68) selected from a coupling agent, a release agent and a coloring agent; and a filler (79-84), where the filler is nano-graphene plate powder. USE - As semiconductor sealing material composition (claimed) used as a packaging material to protect electronic parts such as integrated circuits (ICs), large-scale integrated circuits (LSIs), transistors, diodes, and semiconductor devices from externally-applied shocks, vibrations, moisture, and radiations. ADVANTAGE - The composition has a thermal conductivity of 2-5.5 W/mK, and a toughness of 200-2700 J/m2. The semiconductor sealing material composition has excellent crack resistance at a high temperature of greater than or equal to 270 degrees C and has high thermal conductivity and excellent flame retardancy. The composition provides an environment-friendly semiconductor sealing material which has excellent crack resistance and high thermal conductivity and which satisfies environmental impact assessment factors such as Restriction of hazardous substances (RoHS). The composition does not include halogen element and has improved flame retardancy.