• 专利标题:   Preparing wafer-level single crystal copper foil comprises cutting edges of polycrystalline copper foil to obtain polycrystalline copper foil with notches, and annealing in hydrogen atmosphere to obtain single crystal copper foil.
  • 专利号:   CN112522775-A, CN112522775-B
  • 发明人:   LI Y, LI L, CHEN Z, SU C, TIAN B
  • 专利权人:   UNIV SHENZHEN
  • 国际专利分类:   C01B032/186, C01B032/188, C30B001/02, C30B029/02
  • 专利详细信息:   CN112522775-A 19 Mar 2021 C30B-001/02 202130 Pages: 10 Chinese
  • 申请详细信息:   CN112522775-A CN11344894 26 Nov 2020
  • 优先权号:   CN11344894

▎ 摘  要

NOVELTY - Preparing wafer-level single crystal copper foil comprises cutting the edges of the polycrystalline copper foil to obtain polycrystalline copper foil with notches, and annealing the polycrystalline copper foil with notches in hydrogen atmosphere to obtain single crystal copper foil. USE - The method is useful for preparing wafer-level single crystal copper foil. ADVANTAGE - The method has simple process and high efficiency, and saves energy. The single crystal copper has large area, high single crystal degree and high flatness. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing regular graphene, comprising placing single crystal copper foil in an atmosphere of methane and hydrogen, and growing the graphene on the surface of the single crystal copper foil.