▎ 摘　　要

NOVELTY - A semiconductor device comprises a substrate (10); a semiconductor layer (30) comprising a two-dimensional (2D) material having a layered structure; and an adhesive layer (20) between the substrate and the semiconductor layer and having adhesiveness to the 2D material. USE - A semiconductor device. ADVANTAGE - The semiconductor devices have improved adhesive force at an interface between 2D material and another material layer, high performance by including a 2D material, and high performance and operation characteristics. The semiconductor device having a vertical-type structure using a 2D material may exhibit a relatively high current density even at a low input voltage compared to a horizontal type semiconductor device, and thus, may be used as a low power semiconductor device. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the semiconductor device including a 2D material. Substrate (10) Surface (11) Adhesive layer (20) Semiconductor layer (30)