▎ 摘　　要

NOVELTY - The method involves providing a target substrate (114). An adhesion promoter (113) is applied to a surface of the target substrate. A two-dimensional substrate structure is applied to the surface of the target substrate through the adhesion promoter to form a laminate stack, in which the two-dimensional substrate structure comprising a starting substrate layer and a two-dimensional material (102) on a top surface of the starting substrate layer or a bottom surface of the starting substrate layer. The heat and pressure are applied to the laminate stack. The starting substrate layer is removed from the laminate stack after the heat and pressure is applied to form a target two-dimensional structure. USE - Method of depositing two-dimensional material onto target substrate. ADVANTAGE - The two-dimensional material to be removed from the starting substrate, is allowed without damaging, tearing, or breaking. The target substrate comprising the two-dimensional material can be utilized in rigid or flexible and/or semi-transparent/translucent electronic devices. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a two-dimensional target structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the application of the two-dimensional substrate structure to a target substrate. (Drawing includes non-English language text) 101Starting substrate 102Two-dimensional material 113Adhesion promoter 114Target substrate