▎ 摘　　要

NOVELTY - Conductive silver paste comprises 50-87.8% silver powder, 0-15% ceramic powder, 0.5-9% graphene oxide, 10-15% solvent, 0.5-3% surfactant, 0.2-2% binder, 0.5-2% diluent and 0.5-5% thixotropic agent. The ceramic powder comprises silicon oxide, boron oxide, aluminum oxide, sodium oxide and calcium oxide. USE - The conductive silver paste is useful in ceramic surface circuit printing of the 3 D (claimed). ADVANTAGE - The conductive silver paste has small thermal strain in a high temperature environment, thermal strain of 0.6%, which effectively reduces the thermal stress at the ceramic-silver interface, avoids the falling off of the silver conductive structure at high temperature, and improves the high-temperature stability of the material. DETAILED DESCRIPTION - INDEPENDNEY CLAIMS are also included for: Preparing the conductive silver paste; and Use of the conductive silver paste for circuit printing on ceramic surfaces or the conductive silver paste for circuit printing on ceramic surfaces in 3D printing.