▎ 摘　　要

NOVELTY - Intermediate-temperature curing epoxy structural adhesive film with stable moisture-resistant storage stability, comprises epoxy resin, toughener, curing agent, accelerator and graphene composite of rubber material and carrier prepared by hot melt mixing, it can be cured at 120-130°C; the epoxy structure adhesive film material is prepared using 60-80 pts. wt. epoxy resin, 10-20 pts. wt. toughener, 10-25 pts. wt. curing agent, and 4-12 pts. wt. accelerator and graphene composition. USE - The Intermediate-temperature curing epoxy structural adhesive film with stable moisture-resistant storage stability used as metal material of bearing structure and plate-plate of composite material. It is used in aerospace field. ADVANTAGE - The adhesive film has stable moisture-resistant storage stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for the preparation method of intermediate temperature curing epoxy structural adhesive film with stable moisture-resistant storage stability comprising providing accelerant and graphene oxide, mixing graphene oxide and deionized water, ultrasonically processing for 30 minutes to obtain the uniformly dispersed graphene oxide aqueous solution; dissolving accelerator in the solvent ethanol or acetone, configuring to accelerator solution; mixing the graphene oxide aqueous solution and accelerator solution, under the temperature of 30-60℃, stirring for 30 minutes; filtering the product, vacuum drying to obtain accelerator -graphene composition; adding epoxy resin into the reactor, continuously stirring, heating to 120-140°C, keeping the temperature for 30 minutes to obtain the uniformly mixed epoxy resin, providing epoxy mixture resin, curing agent, toughener and accelerator-graphene composition; using mechanical blending method, uniformly mixing the accelerator-graphene composition and the epoxy resin with the curing agent and toughener to obtain the rubber material; using the film machine at 50 -80℃ for coating the glue material into film, and thermally melting and mixing with the carrier.