• 专利标题:   Thermal interface element of heat exchange system for cooling hot spots on chip, has array of carbon nanotubes that is formed between graphene sheets, and is covalently bonded via carbon-carbon bonds to graphene sheet.
  • 专利号:   EP3136434-A1, WO2017032657-A1
  • 发明人:   KOUMOUTSAKOS P, CHEN J, WALTHER J H
  • 专利权人:   ETH ZUERICH
  • 国际专利分类:   B82Y030/00, H01L023/373, H01L023/42, H01L023/467, H01L023/473
  • 专利详细信息:   EP3136434-A1 01 Mar 2017 H01L-023/373 201717 Pages: 14 English
  • 申请详细信息:   EP3136434-A1 EP182473 26 Aug 2015
  • 优先权号:   EP182473

▎ 摘  要

NOVELTY - A thermal interface material (100) is made of a first graphene sheet (1), a second graphene sheet (2), and an array of carbon nanotubes (3). The array of carbon nanotubes is formed between the graphene sheets. The first end of each carbon nanotube of the array is covalently bonded via carbon-carbon bonds to the first graphene sheet and/or second end of each carbon nanotube of the array is covalently bonded via carbon-carbon bonds to the second graphene sheet. A circulating fluid is in fluid communication with the array of carbon nanotubes. USE - Thermal interface element of heat exchange system (claimed) for cooling hot spots on chip. ADVANTAGE - The high efficient exchange of heat with a surface is attained rapidly. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) heat exchange system; (2) use of thermal interface element; and (3) method for cooling a surface. DESCRIPTION OF DRAWING(S) - The drawing shows the explanatory view of the thermal interface element. Graphene sheets (1,2) Array of carbon nanotube (3) Holes (11,12) Thermal interface material (100)