• 专利标题:   Semiconductor device comprises metal layer, semiconductor layer electrically contacting metal layer, and two-dimensional material layer formed between metal layer and semiconductor layer.
  • 专利号:   US2022140100-A1, KR2022060911-A
  • 发明人:   SHIN H, BYUN K, CHO Y, CHO Y C, BYUN K E, SHIN H J
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   H01L029/45, H01L021/02
  • 专利详细信息:   US2022140100-A1 05 May 2022 H01L-029/45 202242 English
  • 申请详细信息:   US2022140100-A1 US405619 18 Aug 2021
  • 优先权号:   KR147086

▎ 摘  要

NOVELTY - Semiconductor device comprises a metal layer, and a semiconductor layer electrically contacting the metal layer and having a surface treated with a surface-treating element. The surface-treating element is an element having an electron affinity of about 4 eV or greater. Two-dimensional (2D) material layer is formed between the metal layer and the semiconductor layer and having a 2D crystal structure. USE - Semiconductor device. ADVANTAGE - The semiconductor device has improved electrical characteristics and durability by using 2D material layer, and prevents contact resistivity from increasing to reduce overall resistivity. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the relationship between an electron affinity of a surface-treating element and a surface dipole of a semiconductor layer. Semiconductor device (200) Metal layers (210a, 210b) Gate insulating film (240) Gate electrode (250) Spacer (260)