• 专利标题:   Preparing polyimide composite film comprises preparing silicon dioxide/graphene glue solution, surface modification of pure polyimide film, coating silicon dioxide/graphene glue solution on pure polyimide film and heat treatment molding.
  • 专利号:   CN112759784-A, CN112759784-B
  • 发明人:   ZHANG M, WU B, ZHANG C, WENG L, ZHOU L, ZHOU X
  • 专利权人:   SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL, OUBANG TECHNOLOGY SUZHOU CO LTD
  • 国际专利分类:   C08J007/043, C08J007/046, C08J007/06, C08J007/12, C08L079/08
  • 专利详细信息:   CN112759784-A 07 May 2021 C08J-007/06 202147 Pages: 7 Chinese
  • 申请详细信息:   CN112759784-A CN11607697 30 Dec 2020
  • 优先权号:   CN11607697

▎ 摘  要

NOVELTY - Preparing polyimide composite film comprises (a) preparing silicon dioxide/graphene glue solution, where the kinematic viscosity of the glue at 25 degrees C is 0.005-0.03 cm2/second, and the mass fraction of graphene oxide is 1-5 wt.%, (b) carrying out surface modification of pure polyimide film with alkali, and (c) coating the silicon dioxide/graphene glue solution on the pure polyimide film by pulling method after the surface modification treatment, then sequentially performing sealing aging and heat treatment molding to form silicon dioxide/graphene coating to obtain polyimide composite film. USE - The method is useful for preparing polyimide composite film. ADVANTAGE - The method: can tightly combine inorganic coating with organic matrix; and can uniformly disperse inorganic particles. The film: has better mechanical properties, and has excellent wear resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for polyimide composite film prepared by the above method, where the thickness of silicon dioxide/graphene coating is 0.5-5 mu m.