▎ 摘　　要

NOVELTY - Preparing a graphene conductive glue involves selecting a shadowless glue, an acrylate glue, an additive liquid silicone rubber, a single layer graphene, a multilayer graphene, a silver paste, a nickel powder, and a flake copper powder as raw materials, and the above raw materials are separately placed. The single layer of graphene and the multilayer graphene are simultaneously placed in a grinding disperser, and then ground and dispersed to form a first mixed powder, and the first mixed powder has a particle diameter of less than 10 mu m. The nickel powder and the flake copper powder are respectively placed in different grinders, and then ground, and the particle diameter of the nickel powder and the flake copper powder is controlled to 8-10 mu m. The first mixed powder and the nickel powder and the copper powder are processed again placed in an ultrasonic disperser, and ultrasonically dispersed and mixed in environment of 35-50 degrees C, and mixed for 10-20 minutes, after completion. USE - Method for preparing graphene conductive glue. ADVANTAGE - The method enables to prepare graphene conductive glue is effectively ensures the quality of the graphene conductive glue, and it is simple to prepare, and suitable for wide-ranging promotion. DETAILED DESCRIPTION - Preparing a graphene conductive glue involves selecting a shadowless glue, an acrylate glue, an additive liquid silicone rubber, a single layer graphene, a multilayer graphene, a silver paste, a nickel powder, and a flake copper powder as raw materials, and the above raw materials are separately placed. The single layer of graphene and the multilayer graphene are simultaneously placed in a grinding disperser, and then ground and dispersed to form a first mixed powder, and the first mixed powder has a particle diameter of less than 10 mu m. The nickel powder and the flake copper powder are respectively placed in different grinders, and then ground, and the particle diameter of the nickel powder and the flake copper powder is controlled to 8-10 mu m. The first mixed powder and the nickel powder and the copper powder are processed again placed in an ultrasonic disperser, and ultrasonically dispersed and mixed in an environment of 35-50 degrees C, and mixed for 10-20 minutes, after completion. The silver paste is added again, and then the temperature is raised to 60-75 degrees C, and then dispersed and mixed, and after being uniformly mixed, a conductive agent is formed. The reactor is controlled the temperature inside the reactor to 60-80 degrees C, and then placed the shadowless glue, acrylated glue and addition liquid silicone rubber in the reaction kettle in proportion. The conductive agent is uniformly placed in the reaction vessel, and after being uniformly mixed, an auxiliary agent is added in a molar mass ratio of the auxiliary agent to the conductive agent is 1:5, and mixed and stirred for 22-25 hours, after the reaction is completed. The temperature in the reaction kettle is again raised to 75-120 degrees C, and the mixture is allowed to stand still, and the standing time is 6-9 hours. The mixed liquid is taken out, the mixed liquid is placed in the emulsifier again, and the mixed liquid is emulsified at 45-60 degrees C, the emulsification time is 20-50 minutes, and the speed of the emulsifier is 15-18 meter per second, working pressure is 12-15 bar, after completion, after returning to normal temperature to obtain liquid graphene conductive glue.