• 专利标题:   Manufacture of graphene substrate for manufacturing semiconductor element, involves contacting metal layer and carbide layer, dissolving carbon in carbide layer into metal layer, and depositing carbon of metal layer on carbide layer.
  • 专利号:   WO2012060468-A1, US2013214253-A1, JP2012541920-X, US8835286-B2, JP5967486-B2
  • 发明人:   HIURA H, TSUKAGOSHI K
  • 专利权人:   NEC CORP, NAT INST MATERIALS SCI, NEC CORP, NEC CORP, DOKURITSU GYOSEI HOJIN BUSSHITSU ZAIRYO
  • 国际专利分类:   C01B031/04, H01L029/786, H01L021/02, H01L029/16, C01B031/02, H01L021/208, H01L051/05, H01L051/30, H01L051/40, H01L021/20, H01L021/36
  • 专利详细信息:   WO2012060468-A1 10 May 2012 C01B-031/04 201235 Pages: 46 Japanese
  • 申请详细信息:   WO2012060468-A1 WOJP075883 02 Nov 2011
  • 优先权号:   JP247122

▎ 摘  要

NOVELTY - A metal layer (1) is contacted with a carbide layer (2), and carbon (3) in the carbide layer is dissolved into metal layer by heating the metal layer and carbide layer. Carbon in the metal layer is deposited on the surface of the carbide layer in the form of graphene (7) by cooling the metal layer and carbide layer to obtain graphene substrate. USE - Manufacture of graphene substrate used for manufacturing semiconductor element e.g. complementary-type metal oxide. ADVANTAGE - The method efficiently and economically provides graphene substrate having high productivity and quality. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view explaining the manufacture process of graphene substrate. Metal layer (1) Carbide layer (2) Carbon (3) Metal (4) Graphene (7)