• 专利标题:   Polyimide composite material used as core base material in office automation equipment, comprises polyimide acid, heat conducting filler, conductive filler, and auxiliary agent, heat-conducting filler is metal-organic framework material, covalent organic framework, black phosphorus, red phosphorus.
  • 专利号:   CN115558412-A, CN115558412-B
  • 发明人:   LIU Z, WEI Z
  • 专利权人:   SHENZHEN HUAZHIMEI TECHNOLOGY CO LTD
  • 国际专利分类:   C09D179/08, C09D005/24, C09D007/61, C09D007/65
  • 专利详细信息:   CN115558412-A 03 Jan 2023 C09D-179/08 202315 Chinese
  • 申请详细信息:   CN115558412-A CN11246640 12 Oct 2022
  • 优先权号:   CN11246640

▎ 摘  要

NOVELTY - Polyimide composite material comprises polyimide acid (I), heat conducting filler, conductive filler, and auxiliary agent, where the mass ratio of the polyimine acid, heat conducting fillers and conductive fillers is 100:(10-50):(5-40), and the heat-conducting filler is metal-organic framework material, covalent organic framework, black phosphorus, red phosphorus, fullerene, sulfide, selenide, two-dimensional material, graphene, aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride and/or silicon carbide, the conductive filler is selected from conductive polymers, superconducting materials, metal-organic framework materials, covalent organic frameworks, and metal micro-nano materials, the mass ratio of the polyimide acid heat conducting filler and conductive filler is 100:(10-50):(5-40). USE - Polyimide composite material, used as the core base material in office automation equipment (claimed). ADVANTAGE - The polyimide composite material has good heat-conducting performance and conductive performance. DETAILED DESCRIPTION - Polyimide composite material comprises polyimide acid (I), heat conducting filler, conductive filler, and auxiliary agent, where the mass ratio of the polyimine acid, heat conducting fillers and conductive fillers is 100:(10-50):(5-40), and the heat-conducting filler is metal-organic framework material, covalent organic framework, black phosphorus, red phosphorus, fullerene, sulfide, selenide, two-dimensional material, graphene, aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride and/or silicon carbide, the conductive filler is selected from conductive polymers, superconducting materials, metal-organic framework materials, covalent organic frameworks, and metal micro-nano materials, the mass ratio of the polyimide acid heat conducting filler and conductive filler is 100:(10-50):(5-40). Ar unit=alkyl group, an aromatic ring, and an aromatic heterocyclic ring; the number of the aromatic ring or aromatic heterocyclic ring is hydrogen atoms on the aromatic ring or aromatic heterocyclic ring are not substituted by substituents, Or substituted by a substituent selected from alkyl, alkoxy, halogen, oxygen atom, amino, sulfone, carbonyl, aryl, alkenyl, alkynyl, ester, cyano, nitro; n=positive integer; An INDEPENDENT CLAIM is included for a preparation method of the polyimide composite material, which involves (a) preparing the polyimide acid to benzo dithiophene diamine aromatic group with dianhydride under the protection of inert gas, then dehydrating and condensing to obtain polyimide acid; (b) preparing polyimide composite material to the polyimide acid, heat conducting filler, conductive filler, auxiliary agent, solvent to obtain the glue solution, then processed by a coating process, heating to obtain the product