• 专利标题:   Encapsulate used to connect electrical and thermal connections has liquid metal core of liquid metal having mercury, indium and/or gallium and/or alloy having mercury, tin, indium and/or gallium and lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold and/or thallium and shell.
  • 专利号:   US2021287826-A1
  • 发明人:   CREIGHTON M A, MORRIS N J, FARRELL Z J, TABOR C E
  • 专利权人:   US SEC OF AIR FORCE
  • 国际专利分类:   C23C026/00, H01B001/02
  • 专利详细信息:   US2021287826-A1 16 Sep 2021 H01B-001/02 202185 English
  • 申请详细信息:   US2021287826-A1 US337874 03 Jun 2021
  • 优先权号:   US873313P, US337874

▎ 摘  要

NOVELTY - Encapsulate comprises: (a) liquid metal core (3) comprising liquid metal comprising (i) mercury, indium and/or gallium and/or (ii) an alloy comprising mercury, tin, indium and/or gallium, and lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold and/or thallium; and (b) at least one shell that encapsulate the liquid metal, where the shells comprise a first shell comprising a two dimensional material or charge neutral ceramic comprising an anion and a cation, each anion is oxygen, nitrogen, fluorine, phosphorus or sulfur, and each cation comprises e.g. gallium, indium, tin, lead, antimony, cadmium, aluminum, zinc, thallium, bismuth, calcium, scandium, titanium and vanadium, with the provisos that when the cation is gallium, indium and/or tin, the encapsulate comprises second shell (4) having ceramic and/or two dimensional material, that when the liquid metal core is mercury, the encapsulate's first shell comprises two dimensional material. USE - The encapsulates are useful for connecting electrical and thermal connections with connector's electrical responsiveness comprising radio frequency responsiveness, connector's photonic responsiveness comprising infrared responsiveness and/or intense pulsed light responsiveness and connector's mechanical responsiveness comprises tension, compression and/or shear responsiveness (all claimed). ADVANTAGE - The encapsulate can be designed to respond to at least one stimulus of choice, including electromagnetic, thermal, mechanical, photonic, and/or magnetic and are environmentally robust. DETAILED DESCRIPTION - Encapsulate comprises: (a) liquid metal core (3) comprising liquid metal comprising (i) mercury, indium and/or gallium and/or (ii) an alloy comprising mercury, tin, indium and/or gallium, and lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold and/or thallium; and (b) at least one shell that encapsulate the liquid metal, where the shells comprise a first shell comprising a two dimensional material or charge neutral ceramic comprising an anion and a cation, each anion is oxygen, nitrogen, fluorine, phosphorus or sulfur, and each cation is gallium, indium, tin, lead, antimony, cadmium, aluminum, zinc, thallium, bismuth, calcium, scandium, titanium, vanadium, chromium, strontium, yttrium, zirconium, niobium, molybdenum, tellurium, gadolinium, hafnium, praseodymium, neodymium, platinum, samarium, europium, dysprosium, holmium, erbium, ytterbium, plutonium, with the provisos that when the cation is gallium, indium and/or tin, the encapsulate comprises a second shell (4) comprising ceramic and/or a two dimensional material, that when the liquid metal core is mercury, the encapsulate's first shell comprises a two dimensional material, and when the encapsulate's core consists of gallium and indium, the encapsulate comprises a first shell encapsulating the core, the first shell consisting of amorphous gallium oxide, and a second shell encapsulating the first shell, the second shell consisting of silica the encapsulate's core gallium/indium cores is a 85.8 at.% gallium/14.2 at.% indium core. INDEPENDENT CLAIMS are also included for: (1) producing the encapsulate comprising (a) contacting the liquid metal core with a two dimensional material, or (b) contacting the liquid metal core with the anions; and (2) using the encapsulate comprising (a) connecting at least two electrical connections with a connector comprising the encapsulates, where the connector is a solid, a liquid or a liquid comprising a solid and (b) connecting at least two thermal connections with a connector comprising the encapsulates. DESCRIPTION OF DRAWING(S) - The figure shows a cross-sectional view of the liquid metal encapsulate having the non-native shells. Non-native shells (1) Metal or polymer shells (2) Liquid metal core (3) Second shell (4)