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  • 专利标题:   Resin composition used for forming high thermal conductive insulating film, comprises alumina, ceramic compound, graphene oxide and thermosetting resin.
  • 专利号:   KR2013092298-A, KR1333260-B1
  • 发明人:   YOO J B, LEE D H, LEE K S, CHOI H S
  • 专利权人:   DONGHYUN ELECTRONICS CO LTD
  • 国际专利分类:   H01B017/62, H01B003/12, H01B003/22, H01B003/30
  • 专利详细信息:   KR2013092298-A 20 Aug 2013 H01B-003/30 201421 Pages: 11
  • 申请详细信息:   KR2013092298-A KR013947 10 Feb 2012
  • 优先权号:   KR013947

▎ 摘　　要

NOVELTY - A resin composition comprises alumina, ceramic compound, graphene oxide and thermosetting resin. The composition further comprises organic solvent. USE - Resin composition used for forming high thermal conductive insulating film (claimed). ADVANTAGE - The resin composition forms high thermal conductive insulating film without degradation of inner voltage strength.