▎ 摘　　要

NOVELTY - High-modulus epoxy resin adhesive comprises 5-15 pts. wt. epoxy resin, 10-30 pts. wt. cycloaliphatic epoxy resin, 5-20 pts. wt. toughening resin, 30-60 pts. wt. filler, 0.1-5 pts. wt. thixotropic agent, 0.1-1 pts. wt. coupling agent, 0.1-5 pts. wt. photoinitiator, 0.1-5 pts. wt. thermal initiator, 3-10 pts. wt. fluorographene . USE - The high modulus epoxy resin adhesive is useful in vehicle-mounted laser radar (claimed). ADVANTAGE - The high-modulus epoxy resin adhesive: has small shrinkage rate, low thermal expansion, high modulus, strong adhesion to various metal alloy materials, excellent environmental reliability; can be double-cured by UV heating, which solves the coupling between structural parts in the field of vehicle-mounted laser radar. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing high-modulus epoxy resin adhesive comprising (i) pre-baking bisphenol A epoxy resin, cycloaliphatic epoxy resin, and toughening resin at 50-80℃ for 6-12 hours under yellow light illumination, (ii) adding mixed resin into planetary stirred tank with vacuum pumping equipment while still hot, adding coupling agent into the tank and stirring at low speed (100-300 revolutions/minute) for 12-15minutes without vacuumizing, (iii) opening the lid of the tank, adding filler and thixotropic agent into the tank, continue stirring at low speed (100-300 revolutions/minute) for 12-15 minutes without vacuuming, and cooling to below 25℃, (iv) opening the tank cover, adding photoinitiator, thermal initiator, fluorographene, continue stirring at low speed (100-300revolutions/minute) without vacuuming for 12-15 minutes and (v) turning on the vacuum equipment until the vacuum degree reaches above 0.095 MPa, and increasing speed of stirring 400-1000 revolutions/minute and stirring for 40-120 minutes, and discharging final product.