• 专利标题:   Conductive adhesive for high-end refined electronic and electromechanical components, includes epoxy resin, reaction diluents, firming agent, accelerating agent, and strip silver powder modified by graphene.
  • 专利号:   CN102010685-A, CN102010685-B
  • 发明人:   XU Y, WANG J, XIE H
  • 专利权人:   DARBOND TECHNOLOGY CO LTD
  • 国际专利分类:   C09J011/04, C09J163/00, C09J163/02, C09J009/02
  • 专利详细信息:   CN102010685-A 13 Apr 2011 C09J-163/00 201139 Pages: 6 Chinese
  • 申请详细信息:   CN102010685-A CN10572271 03 Dec 2010
  • 优先权号:   CN10572271

▎ 摘  要

NOVELTY - A conductive adhesive comprises (mass %) epoxy resin (40-60), reaction diluents (2-10), firming agent (3-7), accelerating agent (1-3), coupling agent (0.5-1.5), and strip silver powder (20-40) modified by graphene. USE - A conductive adhesive used for conductively sealing and adhering high-end refined electronic and electromechanical components. ADVANTAGE - The adhesive has high conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparing the conductive adhesive, comprising: (A) pre-processing a strip silver powder with graphene to obtain a strip silver powder modified by graphene; (B) mixing epoxy resin, reaction diluents, firming agent, accelerating agent, coupling agent, and strip silver powder modified by graphene; (C) mechanically stirring for 1-2 hours with a rotational velocity of 300-1000 revolutions/minute (rpm), a revolution speed of 5-15 rpm in vacuum of - 0.08-0.1 MPa; and (D) storing at 0-8 degrees C after discharging.