• 专利标题:   Preparing bis-maleic amide self-lubricating wear-resistant swash plate comprises e.g. uniformly mixing bisphenol A type cyanate, diallyl bisphenol A and diamine, stirring, spraying wear-resistant coating solution on swash plate substrate, volatilizing and fine-processing self-lubricating coating.
  • 专利号:   CN113913107-A
  • 发明人:   BU Z
  • 专利权人:   ZHEJIANG RUSHANG TECHNOLOGY CO LTD
  • 国际专利分类:   C09D179/08, C09D007/61, C09D007/62, C09D007/65
  • 专利详细信息:   CN113913107-A 11 Jan 2022 C09D-179/08 202263 Chinese
  • 申请详细信息:   CN113913107-A CN10978815 25 Aug 2021
  • 优先权号:   CN10978815

▎ 摘  要

NOVELTY - Preparing bis-maleic amide self-lubricating wear-resistant swash plate comprises e.g. uniformly mixing bisphenol A type cyanate, diallyl bisphenol A and diamine, adding bisphenol A type cyanate ester, diallyl bisphenol A, stirring, then adding hyperbranched polysiloxane modified graphene oxide, naturally cooling to obtain basic resin, adding tungsten sulfide/molybdenum disulfide solid lubricant, cationic surfactant and anionic surfactant, and mixing uniformly to obtain the wear-resistant self-lubricating coating, plasma surface processing of the swash plate metal substrate, then spraying wear-resistant coating solution on two sides of the swash plate substrate, fully volatilizing the solvent, then naturally cooling to room temperature to form self-lubricating wear-resistant coating, and fine-processing the self-lubricating coating formed on the swash plate metal substrate. USE - The method is useful for preparing bis-maleic amide self-lubricating wear-resistant swash plate. ADVANTAGE - The method: uses bisphenol A type cyanate ester, diallyl bisphenol A and diamine and bismaleimide monomer, polyetherimide reaction to form a bismaleimide resin, can combine with solid lubricant and ionic surfactant, spraying on the surface of the swash plate metal substrate processed by plasma surface, thus improve the self-lubricating property and wear resistance of the swash plate, thus the prepared swash plate is not only has excellent heat resistance, wear resistance, but also has excellent self-lubricating property. DETAILED DESCRIPTION - Preparing bis-maleic amide self-lubricating wear-resistant swash plate comprises (i) uniformly mixing bisphenol A type cyanate, diallyl bisphenol A and diamine according to mol ratio of 1:0.2-0.5:0.5-0.8, keeping the temperature for 1-2 hours at 120degrees Celsius, then heating to 130degrees Celsius and keeping the temperature for 1-2 hours, then adding bisphenol A type cyanate ester, diallyl bisphenol A and the mass sum of diamine 10-20 wt.% bismaleimide monomer and bimaleimide monomer 30-40% polyetherimide, stirring for 0.5-1 hour under the condition of 130degrees Celsius, then adding hyperbranched polysiloxane modified graphene oxide, stirring for 0.5-1 hours, naturally cooling to obtain basic resin; (ii) dissolving the double maleic amide resin prepared in the previous step in solvent to form solution with concentration of 35-40%, the solvent is N-methyl pyrrolidone or dimethyl acetamide, then adding polytetrafluoroethylene, polyvinylidene fluoride or ethylene tetrafluoroethylene, stirring uniformly, then adding the p-phenylenediamine functionalized graphene oxide, nano aluminum oxide, after stirring uniformly, then adding tungsten disulfide/molybdenum (WS2/MoS2) disulfide solid lubricant, cationic surfactant and anionic surfactant, and mixing uniformly to obtain the wear-resistant self-lubricating coating; (iv) plasma surface processing of the swash plate metal substrate, then preheating at 110-130degrees Celsius, then spraying wear-resistant coating solution on two sides of the swash plate substrate, spraying solution at 10-15 g for 2-3 seconds; (v) heating to 200degrees Celsius, keeping the temperature for 3 hours, fully volatilizing the solvent, then heating to 380degrees Celsius, keeping the temperature for 1 hours, then naturally cooling to room temperature to form a self-lubricating wear-resistant coating; and (vi) fine-processing the self-lubricating coating formed on the swash plate metal substrate, and thickness is controlled at 0.01-0.05 mm.